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30 A 载流能力 PCB 设计与实验验证
党旭辉,李清莲,廖双
(中电科技集团重庆声光电有限公司,重庆 400060)

摘  要:通过利用 PCB 设计载流能力相关电流与线宽关系的经验公式,设计了一种基于大负载电磁继电器切换能力的PCB。通过实验验证了设计的 PCB 载流能力、铜箔厚度、线宽以及温升的合理性。结果表明在一定范围内,PCB 铜箔厚度、铜箔宽度、铜箔温升与其载流能力均呈正相关关系。另外发现在最大允许通流范围内,电磁继电器表面温度与其载流能力呈正相关关系。该研究可以用于智能型面板开关电源板的设计与制造。


关键词:载流能力;铜箔厚度;铜箔宽度;温升



DOI:10.19850/j.cnki.2096-4706.2021.15.015


中图分类号:TM581.3                                 文献标识码:A                                     文章编号:2096-4706(2021)15-0060-04


PCB Design and Experimental Verification of 30 A Current Carrying Capacity

DANG Xuhui, LI Qinglian, LIAO Shuang

(Chongqing Acoustic-Optic-Electric Co., Ltd of China Electronics Technology Group Corporation, Chongqing 400060, China)

Abstract: By using PCB to design the empirical formula for the relationship between current carrying capacity and line width, a PCB based on the switching capacity of large load electromagnetic relay is designed. The rationality of the designed PCB current carrying capacity, copper foil thickness, line width, and temperature rise is verified through experiments. The results show that the PCB copper foil thickness, copper foil width, copper foil temperature rise and its current carrying capacity are positively correlated within a certain range. In addition, it is found that the surface temperature of the electromagnetic relay is positively correlated with its current carrying capacity within the maximum allowable through-current range. This study can be used in the design and manufacture of intelligent panel switching power supply boards.

Keywords: current carrying capacity; copper foil thickness; copper foil width; temperature rise


参考文献:

[1] GB/T 4588.3-2002,印制板的设计和使用 [S]. 北京:中国标准出版社,2002.

[2] 祝大同 .PCB 基材——覆铜箔板技术基础(续五) [J]. 印 制电路信息,1997(4):42-47.

[3] 毛楠,孙瑛 . 电子电路抗干扰实用技术 [M]. 北京:国防工业出版社,1996.

[4] 周琛 . 开关电源 PCB 排版基本要点 [J],西安:电源技术应用,2005(9):23-31.

[5] 刘胜利 . 现代高频开关电源实用技术 [M],北京:电子工业出版社,2001.


作者简介:党旭辉(1988—),男,汉族,陕西宝鸡人,工程师,硕士研究生,研究方向:项目管理。