摘 要：超薄型 FPC 由于层间距的减小，使得信号完整问题与 EMC 问题并存。需要对超薄 FPC 版图设计方法进行分析研究，保证信号完整性的同时优化 EMC 问题。通过对目前主流版图设计方法的分析，结合现有的生产工艺水平，给出最优的解决方法。针对信号完整性，给出了网格参考面的占空比选择法。针对 EMC 问题，对网格形式进行了改进，将 45 度斜网格改为垂直网格，将全面均匀网格改为只有走线投影区域均匀网格，显著的改善了网格参考面的隔离度。
关键词：FPC；EMC；信号完整性；网格铜参考面
DOI:10.19850/j.cnki.2096-4706.2022.011.018
中图分类号：TN41 文献标识码：A 文章编号：2096-4706（2022）11-0069-04
Research on Layout Design Method of Ultra-thin FPC
LI Qianzan1,2, XU Mingliang3, GAO XIONG1,2
(1.Central Research Institute, Zhejiang Dahua Technology Co., Ltd., Hangzhou 310053, China; 2.Zhejiang Provincial Key Laboratory of Harmonized Application of Vision & Transmission, Hangzhou 310053, China; 3. Product R&D department, Zhejiang Dahua Technology Co., Ltd.， Hangzhou 310053, China)
Abstract: The reduction of ultra-thin FPC layer spacing makes the signal integrity problem and EMC problem coexist. It is necessary to analyze and study the layout design method of ultra-thin FPC to ensure the signal integrity and optimize the EMC problem at the same time. Through the analysis of the current mainstream layout design methods, combined with the existing production process level, the optimal solution is given. Aiming at the signal integrity, the duty cycle selection method of grid reference surface is given. Aiming at the EMC problem, the grid form is improved. The 45 degree oblique grid is changed to the vertical grid, the comprehensive uniform grid is changed to the uniform grid with only the routing projection area, which significantly improves the isolation degree of the grid reference surface.
Keywords: FPC; EMC; signal integrity; grid copper reference surface
参考文献：
[1] 李钱赞 . 信号完整性与电源完整性的研究与仿真 [D]. 杭州：杭州电子科技大学，2012.
[2] HALL S H，HALL G W. High-Speed Digital System Design：A Handbook of Interconnect Theory and Design Practices [M].IEEE Press，2000.
[3] JOHNSON H，GRAHAM M.High Speed Signal Propagation [M].Prentice Hall，2003.
[4] 林国荣，张友德 . 电磁干扰及控制 [M]. 北京：电子工业出版社，2003.
[5] CANIGGIA S ，MARADEI F . Signal Integrity and Radiated Emission of High-Speed Digital Systems （Caniggia/Signal Integrity and Radiated Emission of High-Speed Digital Systems）：Crosstalk [M].WILEY，2008：125-162.
[6] SHAHPARNIA S，RAMAHI O M . Electromagnetic interference （EMI） reduction from printed circuit boards （PCB）using electromagnetic bandgap structures [J].IEEE Transactions on Electromagnetic Compatibility，2004，46（4）：580-587.
[7] ARMSTRONG M K. PCB design techniques for lowestcost EMC compliance.2 [J].Electronics & Communication Engineering Journal，1999，11（4）：185-194.
[8] BOGATIN E.信号完整性与电源完整性分析 [M].李玉山，刘洋，初秀琴，等译 . 北京：电子工业出版社，2015.
[9] BOGATIN E.Signal and Power Integrity-Simplified [M].Prentice Hall，2018.
[10] RENKO A，RAUNER T V. EMI-Suppression Design in Flexible Printed Circuit Design in Small Electronic Devices[C]//2006 1st Electronic Systemintegration Technology Conference.IEEE，2006：73-79.
[11] 浙江大华技术股份有限公司 . 一种网格铜参考面柔性电路板 FPC：CN201721046269.9 [P].2018-05-22.
作者简介：李钱赞（1984—），男，汉族，浙江杭州人，硕士研究生，信号完整性工程师，职中级工程师，研究方向：信号完整性分析与仿真。