摘 要：随着海外市场的拓展，高质量、高互调天线产品需求急剧提升，又因为三阶互调与焊点的质量有直接的关系。为了提升高性能天线互调良率，评估引入更优质的无铅焊锡材料成为天线行业的迫切需求，本文主要讲述了SnAgCu 系列焊料在天线产品焊接工艺中使用的可靠性及对产品指标稳定性。结果表明，此方式可以有效地选出高性能、高质量、高可靠性的无铅焊料，填补了天线行业无铅焊料选型的空白，降低了选型的难度。
关键词：无铅焊料；助焊剂；温度冲击试验；SnAgCu
中图分类号：TN82 文献标识码：A 文章编号：2096-4706（2019）13-0041-04
Selection and Analysis of Lead-free Solder for Antenna Products
WANG Daming，WANG Pugang，LIAO Keshu
（Comba Telecom（Guangzhou）Co.，Ltd.，Guangzhou 510730，China）
Abstract：With the expansion of overseas market，the demand for high-quality and high-intermodulation antenna products has increased dramatically，because the third-order intermodulation is directly related to the quality of solder joints. In order to improve the yield of high performance antenna intermodulation and evaluate the urgent need of introducing better lead-free solder materials into antenna industry，this paper mainly describes the reliability of SnAgCu series solder used in the welding process of antenna products and the stability of product indicators. The results show that this method can effectively select high performance，high quality and high reliability lead-free solder，fill the blank of lead-free solder selection in antenna industry，and reduce the difficulty of selection.
Keywords：lead-free solder；scaling powder；temperature impact test；SnAgCu
参考文献：
[1] 史建卫，温粤晖. 现代电子装联软钎焊接技术 [M]. 北京：电子工业出版社，2015.
[2] Soldertec. European Lead-Free Technology Roadmap（Version1） [EB/OL].https://www.psma.com/HTML/FILES/forums/leadfree/eu_roadmap_v13.pdf，2003-10-24.
作者简介：王大明（1987.12-），男，汉族，广东广州人，工艺工程师，研究方向：基站天线工艺研究。