摘 要：利用高温共烧陶瓷（HTCC）工艺，研制了一款具有 6 根射频引脚的有引线封装微波管壳，外形尺寸为 20 mm×15 mm×5 mm。同时，在此基础上设计、制作了一款带引脚的表贴式 Ku 波段双通道下变频 3D-SIP 模块，成功实现了模块的表贴化，小型化和封装标准化。其尺寸仅为传统设计方案的 5%，重量小于 5 g。
关键词：3D-SIP；管壳；Ku 波段
DOI:10.19850/j.cnki.2096-4706.2022.01.015
中图分类号：TN12 文献标识码：A 文章编号：2096-4706（2022）01-0056-04
Design of a Surface Mount Tube Shell with Lead Wire that Can Cover DC-20 GHz
LUO Jian
(The 13th Research Institute of China Electronics Technology Corporation, Shijiazhuang 050051, China)
Abstract: Using high temperature co fired ceramic (HTCC) process, a encapsulated microwave tube shell with lead wire and 6 RF pins is developed, and the external dimension is 20 mm × 15 mm × 5 mm. At the same time, on this basis, a surface mount Ku-band dual channel down conversion 3D-SIP module with pins is designed and manufactured, which successfully realizes the surface mount, miniaturization and packaging standardization of the module. Its size is only 5% of the traditional design scheme, and its weight is less than 5 g.
Keywords: 3D-SIP; tube shell; Ku-band
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作者简介：罗建（1981—），男，汉族 ，四川眉山人，工程师，硕士研究生，研究方向：3D-SIP 及微系统。