摘 要:文章采用正交实验设计方法,研究了化成液、化成电压、化成温度、化成时间、化成次数五种影响因素对导电高分子铝电容器电性能及耐回流焊的影响。实验结果表明,化成液、化成电压和化成次数三个因素对产品性能的影响较大。经化成工艺优化后,产品经过 260℃高温回流焊后性能仍非常稳定,适用于新一代氮化镓快速充电器、新能源汽车、服务器、工业电源等要求较高的应用场景。
关键词:固态铝电容器;化成工艺;耐回流焊;漏电流
DOI:10.19850/j.cnki.2096-4706.2022.22.012
中图分类号:TM535;TN605 文献标识码:A 文章编号:2096-4706(2022)22-0050-03
Research on Influencing Factors of Reflow Soldering Resistance of Conductive High Polymer Aluminum Capacitor
LIU Yongpeng
(Zhaoqing Beryl Electronic Technology Co., Ltd., Zhaoqing 526020, China)
Abstract: This paper uses the orthogonal experimental design method to study the influence of five factors such as the formation solution, formation voltage, formation temperature, formation time and formation times, on the electrical properties and reflow soldering resistance of the conductive high polymer aluminum capacitors. The experimental results show that the three factors of formation solution, formation voltage and formation times have greater influence on product performance. After the optimization of the formation process, the performance of the product is still very stable after high temperature reflow soldering at 260° C, which is suitable for the application scenarios with higher requirements such as the gallium nitride fast chargers of new generation, new energy vehicles, servers, industrial power supplies and so on.
Keywords: solid aluminum capacitor; formation process; reflow soldering resistance; leakage current
参考文献:
[1] 杨宏,毛卫民 . 铝电解电容器铝箔的研究现状和技术发展[J]. 材料导报,2005(9):1-4.
[2] 王文宝,秦力,董连军,等 . 固体铝电容专用阳极铝箔的研究现状与发展方向 [J]. 电子元件与材料,2016,35(7):1-6.
[3] 董晓红,匡飞.固体电解质铝电解电容器行业发展概况 [J].铝加工,2015(3):9-13.
[4] 杨邦朝,冯哲圣 . 国内外电容器市场概况分析 [J]. 电子元器件应用,2001,3(1):56-58.
[5] 陈忠逸 . 电容器对铝的需求增速 [J]. 中国有色金属,2007(11):37-38.
[6] 郭洪蕾 . 高介电常数铝阳极复合氧化膜制备技术的研究[D]. 成都:电子科技大学,2006.
[7] 徐友龙.铝电解电容器技术的新进展 [J].电子元件与材料,2008(9):5-7.
作者简介:刘泳澎(1969.02—),男,汉族,广东郁南人,中级工程师,硕士,省级企业技术中心主任,研究方向:铝电解电容器、固态电容器及超级电容器的研究开发和生产制造。